Category: Uncategorized

What is the full form of ‘RDL’, and why is it necessary in advanced packaging                                                                                                   

What is die attach and why is it important in semiconductor packaging? 

How many levels are involved in semiconductor packaging? Describe the levels  depicted in the images below.         

What is the function of substrates in an IC package and what materials are used in making substrates.                                                                                  

For each statement, state whether it is ‘True’ or ‘False’.                              Substrates are the cheapest component in electronic packaging. US currently doesn’t have any onshore substrate manufacturers. Substrates are not necessarily present in every advanced IC packaging. Substrates are crucial for high-end CPU, GPU and 5G chips

Which statement best describes the assembly dynamics of intermediate filaments compared to microtubules?

Unconventional myosin proteins move in a hand-over-hand fashion similar to the kinesin molecule, so at least one of the two heads must be bound to its polarized track at all times.

List three differences between WLP and PLP.

Why did the semiconductor industry shift from DIP packaging to SMT in the 1980s? Discuss at least three technical or manufacturing motivations.

Fill in the boxes with the most accurate step involved in packaging assembly process. Clearly explain any of the two steps you filled in.