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One of the key enabling processing techniques in bulk micromachining is the introduction of a sacrificial layer, which will be completed removed during the device final releasing process.

“When we talk about MEMS devices, we highlight the micro part of it. It means MEMS devices can be batch fabricated (mass production)”. However, MEMS devices have nothing in common in terms of fabrication methods when it compared with IC (integrated circuit) fabrication.

Silicon fusion bonding can be applied to the surfaces with high roughness without any problem.

Anodic bonding can be used for glass to glass, glass to Silicon, glass to metals.

For MEMS (Micro Electro Mechanical Systems) devices (as highlighted in letters of the acronym), Electro-mechanical refers to energy conversion.

DC sputtering cannot be used for depositing dielectrics because insulating cathode will cause charge build up during Ar+ bombarding.

One of the MEMS devices that can be used to characterize surface topology of thin films is atomic force microscopy (AFM), where the cantilever beam deflects because of Van der Waals force between the cantilever beam tip and the sample.

A biochemical sensor is a device that is capable of converting a chemical (or biological) quantity (number of the target analyte) into an electrical signal.

_________refers to the unique characteristic that a transducer has in being unable to repeat faithfully; in the opposite direction of operation, the data that have been recorded in one direction is different than that measured in the opposite direction.

Capacitive MEMS microphones are robust to dust, water and particulate matter.