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Magnetic field and diamagnetic effect can be employed to separate particles such as red vs. white blood cells.

Surface acoustic wave transducers can be used to separate particles.

Misalignment of a rectangular shaped mask opening relative to the [110] direction of major flat of a (100) silicon wafer that results in a larger etched region.

The unit cell in a lattice is a segment representative of the entire lattice and the crystalline structure of a material.

One of the reasons that the (111) planes are normally etched slower than (100) planes is because (100) plane has more dangling bonds for atom at Si surface.

One of the key enabling processing techniques in bulk micromachining is the introduction of a sacrificial layer, which will be completed removed during the device final releasing process.

“When we talk about MEMS devices, we highlight the micro part of it. It means MEMS devices can be batch fabricated (mass production)”. However, MEMS devices have nothing in common in terms of fabrication methods when it compared with IC (integrated circuit) fabrication.

Silicon fusion bonding can be applied to the surfaces with high roughness without any problem.

Anodic bonding can be used for glass to glass, glass to Silicon, glass to metals.

For MEMS (Micro Electro Mechanical Systems) devices (as highlighted in letters of the acronym), Electro-mechanical refers to energy conversion.